The popular and long established SMT USC400 on contact Ultrasonic Stencil System has been upgraded to a higher Transducer power output to support cleaning of the latest generation of Ultra Fine Pitch Solder Pastes from conventional and Pump Print Stencils. The newer generation of UFP Pastes using Class 4 and 5, now 6 particle sizes are easily trapped within the corners of small stencil apertures, causing blockages, loss of print image resolution, and can be difficult to remove, even in high performance offline Cleaning Systems. The SMT USC400 can be taken to the printer online and used to clear blockages without removing the Stencil from the printer, and thereby avoiding the need to reset the Printer parameters.
The USC400 advanced autotune system means no low frequency harmonic vibration is applied to the Stencil, and maximum Transducer power is always available as the cleaning head is moved over the Stencil surface.
The USC400 is ideally suited to mesh mounted legacy Stencils in conventional frames. It is particularly effective when partnered with Surclean SC100, SC400, and the latest SC3003 Stencil cleaning chemistries.