OT2 is the latest SN100C Lead free alloy Solder Paste from Cobar designed to meet growing customer demands for a wide process window combined with faster processing for complex wide mix assemblies. Suitable for use in Air or Nitrogen Convection Reflow systems but can also be used in Vapour Phase reflow systems. The minimal residues are non corrosive, and conform to a wide range of standards for corrosion resistance in service including Bellcore and IPC . Cobar OT2 has excellent fine pitch print characteristics and an extremely high 250 mm per second print speed at typical ambient temperatures of 20 deg. C. OT2 is based on Nihon Superior patented SN100C alloy technology (fully patent license paid), combined with a new Cobar Flux activator technology. This eliminates Head-in-Pillow defects which are critical in Lead free soldering of BGA’s. Further benefits include outstanding soldering of even the smallest components down to 01005 size which can be Reflowed free of Graping or other defects. It features an exceptional tack time of up to 48 hours. OT2 has a wide process window with peak reflow temperaturs typically up to 245 deg. C. and can be processed at high conveyer speeds and short overall cycle times. Residues can be left, but if removal is required, localized cleaning can be carried out with Surclean Ecosolve 200 and 300, or Surclean SC2500 for batch type or automatic cleaning. Standard pack sizes are 500gm tubs, but 40gm techon type syringes and other pack types are available subject to minimum order quantities.